FusionServer CH121L V3 Compute Node
This liquid cooling compute node combines dense computing with an ultra-large memory. It is optimized for enterprise service applications such as virtualization, cloud computing, and High-Performance Computing (HPC).
It forms part of the CH100 and CH200 families of compute nodes, which are fully compatible with Huawei’s E9000 Blade Server.
This efficient compute node features dynamic energy-saving and power-capping technologies that manage and control power consumption with remarkably reduced low-load operating power.
Carrier-class design, manufacturing, and components ensure high quality.
Huawei server with Intel® Xeon® processor.
Intel, the Intel logo, Xeon, and Xeon Inside are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries.
Dense computing capabilities and large memory capacity for enterprise service applications — virtualization, cloud computing, and HPC clusters
- Intel® Xeon® processor E5-2600 v3/v4 family contain up to two 22-core processors to power each compute node
- 24 DDR4 DIMMs, providing a maximum memory capacity of 1.5 TB
- Reduces O&M costs with remote deployment and fault location technologies such as SOL, KVM over IP, virtual DVD-ROM drive, WebUI, and IPMI 2.0 compliance
- Nodes include efficient, secure power consumption analysis and control capabilities, including power-off mode, and Intel® NM 3.0 compliance
- Supports board-level liquid cooling; adopts integrated cooling plates without internal solder points; 80% of heat dissipated through liquid; supports individually maintainable CPUs and memory modules
Specifications
| Form Factor | Half-width 2-socket compute node |
| Number of Processors | 1 or 2 |
| Processor Model | Intel® Xeon® E5-2600 v3/v4 series |
| Number of DIMMs | 24 DDR4 DIMMs, providing a maximum memory capacity of 1.5 TB |
| Number of Hard Disks | 2 x 2.5-inch SSDs, SAS HDDs, or SATA HDDs, supporting 2 x NVMe SSDs |
| Built-in Storage | 2 x Mini-SSDs (SATA DOM)
2 x Micro-SD cards (RAID 1) 1 x USB 3.0 |
| RAID Support | RAID 0 and 1 |
| PCIe Expansion | 2 PCIe x 16 Mezz modules
1 standard PCIe x 16 full-height, half-length card |
| Operating Systems Supported | Microsoft Windows Server 2008/2012
Red Hat Enterprise Linux SUSE Linux Enterprise Server Oracle Linux CentOS Huawei Fusionsphere Citrix XenServer VMware |
| Operating Temperature | 5ºC to 40ºC, ASHRAE Class A3 compliant |
| Dimensions | Height: 60.46 mm (2.38 in.)
Width: 210 mm (8.27 in.) Depth: 537.2 mm (21.15 in.) |
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