FusionServer CH225 V3 All-Flash Compute Node
The CH225 V3 provides superior computing performance and large storage capacity. It uses Intel® Xeon® E5-2600 v3/v4 series processors and supports up to 24 DIMM slots, 12 x 2.5-inch NVMe SSDs, and 2 x 2.5-inch hard disks. The CH225 V3 is suitable for scenarios that require high computing performance and large storage capacity, such as high-performance databases, real-time data analysis, and search.
Huawei server with Intel® Xeon® processor.
Intel, the Intel logo, Xeon, and Xeon Inside are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries.
Ultra-large NVMe Flash memory capacity for the upcoming all-Flash era
- Supports up to 12 x 2.5-inch NVMe SSDs and 2 x 2.5-inch SAS/SATA HDDs or SSDs, delivering up to 9,600,000 IOPS. Delivers industry-leading NVMe storage capacity per node
- Supports the full series and all specifications of Intel® Xeon® E5-2600 v3/v4 processors. Provides 2 x 22-core processors to deliver superior computing capability
- Complies with IPMI V2.0 and supports remote deployment and fault locating methods. Supports remote maintenance using SOL, KVM over IP, virtual CD-ROM drive, and WebUI to reduce O&M costs
- Provides efficient and secure power consumption analysis and control capabilities. SSDs can be separately unloaded on the OS
Specifications
| Form Factor | Full-width, 2-socket compute node |
| Number of Processors | 1 or 2 |
| Processor Model | Intel® Xeon® E5-2600 v3/v4 series |
| Memory | 24 DDR4 DIMMs, providing a maximum memory capacity of 1.5 TB |
| Local Storage | 12 x 2.5-in. NVMe SSDs and 2 x 2.5-in. SAS/SATA HDDs or SSDs |
| Intra-Board Storage | 2 x Mini-SSDs (SATA DOM)
2 x Micro-SD cards (RAID 1) 1 x USB Flash drive (USB 3.0) |
| RAID | 2 x 2.5-in. SAS/SATA HDDs or SSDs (RAID 0 or 1) |
| PCIe Expansion | 4 x mezzanine cards (x16) |
| Operating Temperature | 5ºC to 40ºC (41ºF to 104ºF) |
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